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Prototype Business

Tianma Japan offers high reliability and quality products that utilizes own LCD manufacturing capability/know-hows, provides various types of film deposition, patterning, glass cutting and modularization, and can be a partner who can cooperate in the development of new technologies and new products in material, processing, machine manufacturers and research institutes.

 

Tianma Japan will collaborate to develop new technologies with the clients in display supply chain.

Fields of clients Example for the collaboration with clients
Material manufacturer Validation of new material in LCD/OLED panel
Facility manufacturer Validation of new process of LCD/OLED/TFT process
Design house Making prototype/Performance evaluation for new design
 


Tianma Japan will work with clients in the wide variety of technical fields as well as display technologies.

Typical expertise and technical fields;
Design (electronic circuit, optical, thermal …)
LCD (rubbing, photo orientation, color filter …)
Organic luminescent device (organic & metal film deposition, reflective electrode, semi-transparent electrode …)
Inorganic luminescent device (micro-LED, mini-LED …)
TFT (a-Si:H, LTPS(poly-Si), metal oxide semiconductor, organic semiconductor)
Sensing (light, pH, ions, electrostatic potential, heat flow, hydrogen, fingerprint, FPIA, piezoelectric element …)
Mounting/bonding (COG, FOG, laminating, OCA, OCR …)
Sealing (UV curable resin, glass frit …)
Flexible substrate (polyimide coating, laser lift-off …)
 

Feature of prototype

Integrated process (deposition, patterning, cutting)
Maximum size of glass:370x470mm (up to 550x660mm is possible depending on request) thickness of glass:0.5mm,0.7mm
Various metal materials, inorganic insulating film materials, and organic insulating film materials are available
Support small-quantity level trial production to mass production.
Support design such as CAD works.
Support the production of products not only LCD and the contract processing of prototypes using LCD manufacturing technology, equipment, and know-how.

 

 
 

Available process

■Array substrate processing

Process

Equipment

Remarks

Available array

Purchased item

370x470mm 0.5t/0.7t
550x660mm 0.5t/0.7t

Cleaning

UV/Chemical/Brush/High pressure/Ultrasonic/Pure water

 

Deposition

Metal
 thickness:please refer following table

Sputter

Al, Mo, Ti, Cu, Cr, Ag, ITO, etc.

Insulator (inorganic)
 thickness:please refer following table

P-CVD

SiNx, SiOx, etc.

Insulator (organic)
 thickness:please refer following table

Spin coater

Acrylic resin, Novolak resin, Polyimide resin

Semiconductor
 thickness:please refer following table

P-CVD, Sputter

a-Si, poly-Si(*ELA), InGaZnO₄

Patterning

Photolithography
 

Coating resist

Spin coater

 

Exposure

 

*Tianma Japan can support design

Aligner

Processing ability≥4μm
Overlay accuracy≤±2μm

Stepper

Processing ability≥4μm
Overlay accuracy≤±2μm

Development

Development

 

Etching

Dry etching

SiOx, SiN, Al, Ti, Cr, etc.

Wet etching

Al, Mo, ITO, etc.

Stripping

Amine based treatment

 

High temperature annealing(bake)

Hot air circulation

O2 concentration can be adjusted by N2

poly-Si(LTPS)

characteristic control processing

Crystallization

Excimer laser annealing(ELA)

 

Doping

Ion implantation(Large current)

Ion shower type(S/D)

Ion implantation(medium current)

Mass separated type(Channel, LDD)

Activation

Furnace anneal

 

Metal marking

Laser marker

 

Measurement sheet resistance

Four terminal sensing

1mΩ~1GΩ

Thikness
Measurement

a-Si, SiNx, SiOx, ITO, etc.

Spectroscopic ellipsometer

 

Metal, Organic, etc.

Step measurement

 

Electrical measurement

Transistor characteristics, Wiring resistance, Contact resistance, etc.

Parameter analyzer, handy tester

 

Defect detection by automatic appearance (AOI)

Repeated pattern comparison

 

Repair

Short repair

Open circuit repair

Laser shortcut

Deposition

ITO selective cut by the 3rd harmonic is available

CVD equipment slot CVD equipment ITO sputter
CVD equipment slot CVD equipment ITO sputter
Photolithography equipment slot Stepper Dry etching equipment
Photolithography equipment slot Stepper Dry etching equipment
 


Table1:Deposition material, Thickness, Line width, Resistance
 Below is available type of material, thickness.

 

Type

Thickness
(nm)

Minimum line width / Spacing(μm)

Ratio value
(μΩ·cm)

Remark

Wiring/
Electrode

AL alloy

30~1000

3/5

10

 

Mo alloy

30~150

3/4.5

16

AL and Mo lamination available

Ti

30~300

3/4

100

AL and Ti lamination available

Cu

30~200

3/7

3

 

Cr

30~500

3/4

20

 

Ag alloy

30~500

3/4.5

4

 

ITO (Transparent conductive)

40~150

3/3

200

AG and ITO lamination available

Thickness, line width and spacing is just guideline.


Table2:Material, Thickness, Line width

 

Type

Thickness
(nm)

Minimum line width / Spacing(μm)

Remark

Insulator

SiNx

50~1000

5

Contact hole formation available

SiOx

50~200

5

Acrylic resin

1500~2000

10

Novolak resin

1500~2000

10

Polyimide resin

1500~2200

10

 

a-Si

10~250

5

 

poly-Si

30~50

5

InGaZnO₄

30~200

5

Thickness, line width and spacing is just guideline. If you have request, please let us know.


■Color filter processing
Color filter can also be formed on the wiring board.

Available contents

Equipment

Remark

Substrate

Purchased item

370x470mm 0.5t/0.7t
550x660mm 0.5t/0.7t

Cleaning

UV/Chemical/Brush/High pressure/Ultrasonic/Pure water

 

Patterning

Photolithography

BM, Color layer (R,G,B) Post spacer, Overcoat(patterning not available)

Spin coater or Slit & Spin coat

Acrylic resin

Exposure

*Tianma Japan can support mask layout design

Proximity

Processing ability ±1.5μm
Overlay ability ±2.5μm

Development

Development

 

Baking (Thermosetting material)

Hot air circulation or Hotplate

 

Measuring thickness

Non-contact measurement

Laser microscope

 

Contact measurement

Step measurement

 

Pattern dimensional measurement

Microscope

 

Defect detection by automated visual inspection (AOI) inspection

Repeated pattern comparison

 

CF Saturation spectroscopy

Spectroscopy machine

 
Color filter line AOI step measure
color filter line AOI step measure

■Cell process

Available contents

Equipment

Remark

Substrate

 

370x470mm 0.5t/0.7t
550x322mm 0.5t/0.7t

Cleaning

UV/Chemical/Brush/High pressure/Ultrasonic/Pure water

 

Alignment printing

Flexography

 

Alignment baking

Hot air circulation · IR baking

 

Alignment method

Rubbing · Photo alignment

 

Coating sealing material

Printing · Dispensing

Seal width:0.5~2mm level

Spherical spacer spraying for cell gap formation

 

 

Superposition of wiring board and CF board

Alignment equipment

Overlay ability ±6μm

Thermosetting and UV curing (sealing material)

Press type thermosetting

UV irradiation curing

 

Cutting

Regular

Free form

· Regular tolerance:±0.3mm

Liquid crystal injection

Injection device

 

Sealing

(Removal of excess liquid crystal material, Coating of sealing material, UV curing)

Pressurized sealing device

UV irradiation device

 

ODF

ODF  

Slimming

Chemical etching (outsource)

Up to 0.2t on one side

 

Polishing

Polishing machine

 

Cleaning

Neutral detergent & Pure water cleaning

 

Cell gap measurement

Gap measuring device

 

Reusing dummy board

alignment film removing machine

Reuse of dummy board

(Improvement of efficiency)

Cleaning alignment printing

Cleaning machine

NMP cleaning

 

Inspection
(Open short check, Visual inspection, etc.)

 

 

photo aligner
photo aligner
 


■Assembly process

Available contents

Equipment

Remark

IC(COG), FPC/Board (FOG/FOB)mounting

Connection by ACF

 

Resin coating around the pressure welding part

Silicon RTV resin

 

Connection of wiring board & CF board by attaching conductive tape, etc.

Tape application device

 

Liquid crystal module aging process

Aging tank

 

Inspection (Operation inspection, Visual inspection, etc.)

   
COG/FOG line COF/FOB line
COG/FOG line COF/FOB line


■Bonding

Available contents

Equipment

Remark

Bonding

Film bonding device machine

Available size (middle size)
 108x167~370x500mm

Available size (large size)
 200x300~650x650mm

Sensor & Touch panel bonding

Includes vacuum bonding UV curing treatment by OCR

Available size
 87x142~325x490mm

OCA bonding

Touch panel bonding to LCD module

Includes vacuum bonding UV curing treatment by OCR

OCA bonding

Adhesive bonding

Film bonding equipment Vacuum bonding equipment
Film bonding equipment Vacuum bonding equipment
 

■OLED

Available contents

Equipment

Remark

Deposition of OLED material (OLED layer formation)

OLED material deposition equipment

Available size
200x185mm

Sealing after deposition of OLED material

Glove box

Laser welding equipment

 

Globe box
Globe box


■Reliability test

Available contents

Equipment

Remark

Temperature and Humidity Controlled Test

HHBT, HBT, HHT, HT, LT, LBT

[Tank]
Temperature:-70℃~+150℃
Humidity:20~98%RH

 

HT, HBT

[Tank]
Temperature:20℃~200℃

 

Thermal shock test

TS

Low temperature:-65℃~0℃
High temperature:60℃~200℃

 

ESD

HBM, MM, Surface discharge

Voltage:±30KV

 

PCT test

PCT

Temperature:105℃~162.2℃
Humidity:75~100%RH

 
temperature and humidity testing chamber thermal shock testing equipment pressure cooker
temperature and humidity testing chamber thermal shock testing equipment pressure cooker


Case of product 1: LCD materials evaluation

 

Tianma Japan offers the substrate for evaluation of Liquid Cristal , Polyimide materials.

 

Case of product 2: OLED materials evaluation

Tianma Japan Sample image
 

Offering the substrate for OLED materials.

 

Case of product 3: ACF material evaluation



 

Tianma Japan supports test samples for evaluation ACF materials.