Prototype Business
Tianma Japan offers high reliability and quality products that utilizes own LCD manufacturing capability/know-hows, provides various types of film deposition, patterning, glass cutting and modularization, and can be a partner who can cooperate in the development of new technologies and new products in material, processing, machine manufacturers and research institutes.
Tianma Japan will collaborate to develop new technologies with the clients in display supply chain.
Fields of clients | Example for the collaboration with clients |
Material manufacturer | Validation of new material in LCD/OLED panel |
Facility manufacturer | Validation of new process of LCD/OLED/TFT process |
Design house | Making prototype/Performance evaluation for new design |
Tianma Japan will work with clients in the wide variety of technical fields as well as display technologies.
Typical expertise and technical fields; |
Design (electronic circuit, optical, thermal …) |
LCD (rubbing, photo orientation, color filter …) |
Organic luminescent device (organic & metal film deposition, reflective electrode, semi-transparent electrode …) |
Inorganic luminescent device (micro-LED, mini-LED …) |
TFT (a-Si:H, LTPS(poly-Si), metal oxide semiconductor, organic semiconductor) |
Sensing (light, pH, ions, electrostatic potential, heat flow, hydrogen, fingerprint, FPIA, piezoelectric element …) |
Mounting/bonding (COG, FOG, laminating, OCA, OCR …) |
Sealing (UV curable resin, glass frit …) |
Flexible substrate (polyimide coating, laser lift-off …) |
Feature of prototype
• Integrated process (deposition, patterning, cutting) |
• Maximum size of glass:370x470mm (up to 550x660mm is possible depending on request) thickness of glass:0.5mm,0.7mm |
• Various metal materials, inorganic insulating film materials, and organic insulating film materials are available |
• Support small-quantity level trial production to mass production. |
• Support design such as CAD works. |
• Support the production of products not only LCD and the contract processing of prototypes using LCD manufacturing technology, equipment, and know-how. |
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Available process
■Array substrate processing
Process |
Equipment |
Remarks |
|
Available array |
Purchased item |
370x470mm 0.5t/0.7t |
|
Cleaning |
UV/Chemical/Brush/High pressure/Ultrasonic/Pure water |
||
Deposition |
Metal |
Sputter |
Al, Mo, Ti, Cu, Cr, Ag, ITO, etc. |
Insulator (inorganic) |
P-CVD |
SiNx, SiOx, etc. |
|
Insulator (organic) |
Spin coater |
Acrylic resin, Novolak resin, Polyimide resin |
|
Semiconductor |
P-CVD, Sputter |
a-Si, poly-Si(*ELA), InGaZnO₄ |
|
Patterning Photolithography |
Coating resist |
Spin coater |
|
Exposure
*Tianma Japan can support design |
Aligner |
Processing ability≥4μm |
|
Stepper |
Processing ability≥4μm |
||
Development |
Development |
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Etching |
Dry etching |
SiOx, SiN, Al, Ti, Cr, etc. |
|
Wet etching |
Al, Mo, ITO, etc. |
||
Stripping |
Amine based treatment |
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High temperature annealing(bake) |
Hot air circulation |
O2 concentration can be adjusted by N2 |
|
poly-Si(LTPS) characteristic control processing |
Crystallization |
Excimer laser annealing(ELA) |
|
Doping |
Ion implantation(Large current) |
Ion shower type(S/D) |
|
Ion implantation(medium current) |
Mass separated type(Channel, LDD) |
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Activation |
Furnace anneal |
|
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Metal marking |
Laser marker |
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Measurement sheet resistance |
Four terminal sensing |
1mΩ~1GΩ |
|
Thikness |
a-Si, SiNx, SiOx, ITO, etc. |
Spectroscopic ellipsometer |
|
Metal, Organic, etc. |
Step measurement |
||
Electrical measurement |
Transistor characteristics, Wiring resistance, Contact resistance, etc. |
Parameter analyzer, handy tester |
|
Defect detection by automatic appearance (AOI) |
Repeated pattern comparison |
||
Repair |
Short repair Open circuit repair |
Laser shortcut Deposition |
ITO selective cut by the 3rd harmonic is available |
CVD equipment slot | CVD equipment | ITO sputter |
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Photolithography equipment slot | Stepper | Dry etching equipment |
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Table1:Deposition material, Thickness, Line width, Resistance
Below is available type of material, thickness.
|
Type |
Thickness |
Minimum line width / Spacing(μm) |
Ratio value |
Remark |
Wiring/ |
AL alloy |
30~1000 |
3/5 |
10 |
|
Mo alloy |
30~150 |
3/4.5 |
16 |
AL and Mo lamination available |
|
Ti |
30~300 |
3/4 |
100 |
AL and Ti lamination available |
|
Cu |
30~200 |
3/7 |
3 |
||
Cr |
30~500 |
3/4 |
20 |
||
Ag alloy |
30~500 |
3/4.5 |
4 |
||
ITO (Transparent conductive) |
40~150 |
3/3 |
200 |
AG and ITO lamination available |
Thickness, line width and spacing is just guideline.
Table2:Material, Thickness, Line width
|
Type |
Thickness |
Minimum line width / Spacing(μm) |
Remark |
Insulator |
SiNx |
50~1000 |
5 |
Contact hole formation available |
SiOx |
50~200 |
5 |
||
Acrylic resin |
1500~2000 |
10 |
||
Novolak resin |
1500~2000 |
10 |
||
Polyimide resin |
1500~2200 |
10 |
||
a-Si |
10~250 |
5 |
|
|
poly-Si |
30~50 |
5 |
||
InGaZnO₄ |
30~200 |
5 |
Thickness, line width and spacing is just guideline. If you have request, please let us know.
■Color filter processing
Color filter can also be formed on the wiring board.
Available contents |
Equipment |
Remark |
|
Substrate |
Purchased item |
370x470mm 0.5t/0.7t |
|
Cleaning |
UV/Chemical/Brush/High pressure/Ultrasonic/Pure water |
||
Patterning Photolithography |
BM, Color layer (R,G,B) Post spacer, Overcoat(patterning not available) |
Spin coater or Slit & Spin coat |
Acrylic resin |
Exposure *Tianma Japan can support mask layout design |
Proximity |
Processing ability ±1.5μm |
|
Development |
Development |
|
|
Baking (Thermosetting material) |
Hot air circulation or Hotplate |
||
Measuring thickness |
Non-contact measurement |
Laser microscope |
|
Contact measurement |
Step measurement |
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Pattern dimensional measurement |
Microscope |
||
Defect detection by automated visual inspection (AOI) inspection |
Repeated pattern comparison |
|
|
CF Saturation spectroscopy |
Spectroscopy machine |
Color filter line | AOI | step measure |
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■Cell process
Available contents |
Equipment |
Remark |
Substrate |
370x470mm 0.5t/0.7t |
|
Cleaning |
UV/Chemical/Brush/High pressure/Ultrasonic/Pure water |
|
Alignment printing |
Flexography |
|
Alignment baking |
Hot air circulation · IR baking |
|
Alignment method |
Rubbing · Photo alignment |
|
Coating sealing material |
Printing · Dispensing |
Seal width:0.5~2mm level |
Spherical spacer spraying for cell gap formation |
|
|
Superposition of wiring board and CF board |
Alignment equipment |
Overlay ability ±6μm |
Thermosetting and UV curing (sealing material) |
Press type thermosetting UV irradiation curing |
|
Cutting |
Regular Free form |
· Regular tolerance:±0.3mm |
Liquid crystal injection |
Injection device |
|
Sealing (Removal of excess liquid crystal material, Coating of sealing material, UV curing) |
Pressurized sealing device UV irradiation device |
|
ODF |
ODF | |
Slimming |
Chemical etching (outsource) Up to 0.2t on one side |
|
Polishing |
Polishing machine |
|
Cleaning |
Neutral detergent & Pure water cleaning |
|
Cell gap measurement |
Gap measuring device |
|
Reusing dummy board |
alignment film removing machine |
Reuse of dummy board (Improvement of efficiency) |
Cleaning alignment printing |
Cleaning machine NMP cleaning |
|
Inspection |
|
photo aligner |
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■Assembly process
Available contents |
Equipment |
Remark |
IC(COG), FPC/Board (FOG/FOB)mounting |
Connection by ACF |
|
Resin coating around the pressure welding part |
Silicon RTV resin |
|
Connection of wiring board & CF board by attaching conductive tape, etc. |
Tape application device |
|
Liquid crystal module aging process |
Aging tank |
|
Inspection (Operation inspection, Visual inspection, etc.) |
COG/FOG line | COF/FOB line |
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■Bonding
Available contents |
Equipment |
Remark |
Bonding |
Film bonding device machine |
Available size (middle size) Available size (large size) |
Sensor & Touch panel bonding |
Includes vacuum bonding UV curing treatment by OCR |
Available size 87x142~325x490mm |
OCA bonding |
||
Touch panel bonding to LCD module |
Includes vacuum bonding UV curing treatment by OCR |
|
OCA bonding |
||
Adhesive bonding |
Film bonding equipment | Vacuum bonding equipment |
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■OLED
Available contents |
Equipment |
Remark |
Deposition of OLED material (OLED layer formation) |
OLED material deposition equipment |
Available size |
Sealing after deposition of OLED material |
Glove box Laser welding equipment |
|
Globe box |
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■Reliability test
Available contents |
Equipment |
Remark |
|
Temperature and Humidity Controlled Test |
HHBT, HBT, HHT, HT, LT, LBT |
[Tank] |
|
HT, HBT |
[Tank] |
||
Thermal shock test |
TS |
Low temperature:-65℃~0℃ |
|
ESD |
HBM, MM, Surface discharge |
Voltage:±30KV |
|
PCT test |
PCT |
Temperature:105℃~162.2℃ |
temperature and humidity testing chamber | thermal shock testing equipment | pressure cooker |
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Case of product 1: LCD materials evaluation
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Tianma Japan offers the substrate for evaluation of Liquid Cristal , Polyimide materials.
Case of product 2: OLED materials evaluation
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Tianma Japan Sample image |
Offering the substrate for OLED materials.
Case of product 3: ACF material evaluation
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Tianma Japan supports test samples for evaluation ACF materials.