Prototype Business

Tianma Japan offers high reliability and quality products that utilizes own LCD manufacturing capability/know-hows, provides various types of film deposition, patterning, glass cutting and modularization, and can be a partner who can cooperate in the development of new technologies and new products in material, processing, machine manufacturers and research institutes.

Tianma Japan will collaborate to develop new technologies with the clients in display supply chain.

Fields of clients	Example for the collaboration with clients
Material manufacturer	Validation of new material in LCD/OLED panel
Facility manufacturer	Validation of new process of LCD/OLED/TFT process
Design house	Making prototype/Performance evaluation for new design

Tianma Japan will work with clients in the wide variety of technical fields as well as display technologies.

Typical expertise and technical fields;

Design (electronic circuit, optical, thermal …)

LCD (rubbing, photo orientation, color filter …)

Organic luminescent device (organic & metal film deposition, reflective electrode, semi-transparent electrode …)

Inorganic luminescent device (micro-LED, mini-LED …)

TFT (a-Si:H, LTPS(poly-Si), metal oxide semiconductor, organic semiconductor)

Sensing (light, pH, ions, electrostatic potential, heat flow, hydrogen, fingerprint, FPIA, piezoelectric element …)

Mounting/bonding (COG, FOG, laminating, OCA, OCR …)

Sealing (UV curable resin, glass frit …)

Flexible substrate (polyimide coating, laser lift-off …)

Feature of prototype

• Integrated process (deposition, patterning, cutting)

• Maximum size of glass:370x470mm (up to 550x660mm is possible depending on request) thickness of glass:0.5mm,0.7mm

• Various metal materials, inorganic insulating film materials, and organic insulating film materials are available

• Support small-quantity level trial production to mass production.

• Support design such as CAD works.

• Support the production of products not only LCD and the contract processing of prototypes using LCD manufacturing technology, equipment, and know-how.

Available process

■Array substrate processing

Process		Equipment	Remarks
Available array		Purchased item	370x470mm 0.5t/0.7t 550x660mm 0.5t/0.7t
Cleaning		UV/Chemical/Brush/High pressure/Ultrasonic/Pure water
Deposition	Metal thickness:please refer following table	Sputter	Al, Mo, Ti, Cu, Cr, Ag, ITO, etc.
	Insulator (inorganic) thickness:please refer following table	P-CVD	SiNx, SiOx, etc.
	Insulator (organic) thickness:please refer following table	Spin coater	Acrylic resin, Novolak resin, Polyimide resin
	Semiconductor thickness:please refer following table	P-CVD, Sputter	a-Si, poly-Si(*ELA), InGaZnO₄
Patterning Photolithography	Coating resist	Spin coater
	Exposure *Tianma Japan can support design	Aligner	Processing ability≥4μm Overlay accuracy≤±2μm
	Exposure *Tianma Japan can support design	Stepper	Processing ability≥4μm Overlay accuracy≤±2μm
	Development	Development
	Etching	Dry etching	SiOx, SiN, Al, Ti, Cr, etc.
	Etching	Wet etching	Al, Mo, ITO, etc.
	Stripping	Amine based treatment
High temperature annealing(bake)		Hot air circulation	O2 concentration can be adjusted by N2
poly-Si(LTPS) characteristic control processing	Crystallization	Excimer laser annealing(ELA)
	Doping	Ion implantation(Large current)	Ion shower type(S/D)
	Doping	Ion implantation(medium current)	Mass separated type(Channel, LDD)
	Activation	Furnace anneal
Metal marking		Laser marker
Measurement sheet resistance		Four terminal sensing	1mΩ~1GΩ
Thikness Measurement	a-Si, SiNx, SiOx, ITO, etc.	Spectroscopic ellipsometer
Thikness Measurement	Metal, Organic, etc.	Step measurement
Electrical measurement	Transistor characteristics, Wiring resistance, Contact resistance, etc.	Parameter analyzer, handy tester
Defect detection by automatic appearance (AOI)		Repeated pattern comparison
Repair	Short repair Open circuit repair	Laser shortcut Deposition	ITO selective cut by the 3rd harmonic is available

CVD equipment slot	CVD equipment	ITO sputter

Photolithography equipment slot	Stepper	Dry etching equipment

Table1:Deposition material, Thickness, Line width, Resistance
Below is available type of material, thickness.

	Type	Thickness (nm)	Minimum line width / Spacing(μm)	Ratio value (μΩ·cm)	Remark
Wiring/ Electrode	AL alloy	30~1000	3/5	10
	Mo alloy	30~150	3/4.5	16	AL and Mo lamination available
	Ti	30~300	3/4	100	AL and Ti lamination available
	Cu	30~200	3/7	3
	Cr	30~500	3/4	20
	Ag alloy	30~500	3/4.5	4
	ITO (Transparent conductive)	40~150	3/3	200	AG and ITO lamination available

Thickness, line width and spacing is just guideline.

Table2:Material, Thickness, Line width

	Type	Thickness (nm)	Minimum line width / Spacing(μm)	Remark
Insulator	SiNx	50~1000	5	Contact hole formation available
	SiOx	50~200	5
	Acrylic resin	1500~2000	10
	Novolak resin	1500~2000	10
	Polyimide resin	1500~2200	10
	a-Si	10~250	5
	poly-Si	30~50	5
	InGaZnO₄	30~200	5

Thickness, line width and spacing is just guideline. If you have request, please let us know.

■Color filter processing
Color filter can also be formed on the wiring board.

Available contents		Equipment	Remark
Substrate		Purchased item	370x470mm 0.5t/0.7t 550x660mm 0.5t/0.7t
Cleaning		UV/Chemical/Brush/High pressure/Ultrasonic/Pure water
Patterning Photolithography	BM, Color layer (R,G,B) Post spacer, Overcoat(patterning not available)	Spin coater or Slit & Spin coat	Acrylic resin
	Exposure *Tianma Japan can support mask layout design	Proximity	Processing ability ±1.5μm Overlay ability ±2.5μm
	Development	Development
Baking (Thermosetting material)		Hot air circulation or Hotplate
Measuring thickness	Non-contact measurement	Laser microscope
Measuring thickness	Contact measurement	Step measurement
Pattern dimensional measurement		Microscope
Defect detection by automated visual inspection (AOI) inspection		Repeated pattern comparison
CF Saturation spectroscopy		Spectroscopy machine

Color filter line	AOI	step measure

■Cell process

Available contents	Equipment	Remark
Substrate		370x470mm 0.5t/0.7t 550x322mm 0.5t/0.7t
Cleaning	UV/Chemical/Brush/High pressure/Ultrasonic/Pure water
Alignment printing	Flexography
Alignment baking	Hot air circulation · IR baking
Alignment method	Rubbing · Photo alignment
Coating sealing material	Printing · Dispensing	Seal width:0.5~2mm level
Spherical spacer spraying for cell gap formation
Superposition of wiring board and CF board	Alignment equipment	Overlay ability ±6μm
Thermosetting and UV curing (sealing material)	Press type thermosetting UV irradiation curing
Cutting	Regular Free form	· Regular tolerance:±0.3mm
Liquid crystal injection	Injection device
Sealing (Removal of excess liquid crystal material, Coating of sealing material, UV curing)	Pressurized sealing device UV irradiation device
ODF	ODF
Slimming	Chemical etching (outsource) Up to 0.2t on one side
Polishing	Polishing machine
Cleaning	Neutral detergent & Pure water cleaning
Cell gap measurement	Gap measuring device
Reusing dummy board	alignment film removing machine	Reuse of dummy board (Improvement of efficiency)
Cleaning alignment printing	Cleaning machine NMP cleaning
Inspection (Open short check, Visual inspection, etc.)

photo aligner

■Assembly process

Available contents	Equipment	Remark
IC(COG), FPC/Board (FOG/FOB)mounting	Connection by ACF
Resin coating around the pressure welding part	Silicon RTV resin
Connection of wiring board & CF board by attaching conductive tape, etc.	Tape application device
Liquid crystal module aging process	Aging tank
Inspection (Operation inspection, Visual inspection, etc.)

COG/FOG line	COF/FOB line

■Bonding

Available contents	Equipment	Remark
Bonding	Film bonding device machine	Available size (middle size) 108x167~370x500mm Available size (large size) 200x300~650x650mm
Sensor & Touch panel bonding	Includes vacuum bonding UV curing treatment by OCR	Available size 87x142~325x490mm
Sensor & Touch panel bonding	OCA bonding
Touch panel bonding to LCD module	Includes vacuum bonding UV curing treatment by OCR
	OCA bonding
	Adhesive bonding

Film bonding equipment	Vacuum bonding equipment

■OLED

Available contents

Equipment

Remark

Deposition of OLED material (OLED layer formation)

OLED material deposition equipment

Available size
200x185mm

Sealing after deposition of OLED material

Glove box

Laser welding equipment

Globe box

■Reliability test

Available contents		Equipment	Remark
Temperature and Humidity Controlled Test	HHBT, HBT, HHT, HT, LT, LBT	[Tank] Temperature:-70℃~+150℃ Humidity:20~98%RH
Temperature and Humidity Controlled Test	HT, HBT	[Tank] Temperature:20℃~200℃
Thermal shock test	TS	Low temperature:-65℃~0℃ High temperature:60℃~200℃
ESD	HBM, MM, Surface discharge	Voltage:±30KV
PCT test	PCT	Temperature:105℃~162.2℃ Humidity:75~100%RH